DUH-210/DUH-210S

DUH-210/DUH-210S 動態超微小硬度計

DUH-211/DUH-211S

用於測量顯微區域材料強度的新評估系統,例如半導體、LSI、陶瓷、硬碟、氣相沉積薄膜和薄塗層,這些是先前硬度試驗機無法處理的領域。也可以用於評估塑膠和橡膠的硬度。此儀器獨特測量動態壓痕深度,而非試驗之後的壓痕。這可進而測量傳統方法無法測量,非常薄的薄膜和表面 (處理) 層。此外,相同方法可提供所需資料,對試驗樣品計算彈性模數。

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